The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 07, 2006
Filed:
Feb. 27, 2004
Mark J. Boldizar, Lancaster, PA (US);
Robert T. Gamble, Boothwyn, PA (US);
Vincent Matthew Hedrick, Weston, FL (US);
Jason M. Lawhorn, Newark, DE (US);
Alan H. Saikin, Landenberg, PA (US);
Katherine L. Tome, Port Deposit, MD (US);
Mark J. Boldizar, Lancaster, PA (US);
Robert T. Gamble, Boothwyn, PA (US);
Vincent Matthew Hedrick, Weston, FL (US);
Jason M. Lawhorn, Newark, DE (US);
Alan H. Saikin, Landenberg, PA (US);
Katherine L. Tome, Port Deposit, MD (US);
Rohm and Haas Electronic Materials CMP Holdings, Inc., Newark, DE (US);
Abstract
A method of forming a layered polishing pad is disclosed. The method includes double-laminating a subpad on opposing sides with respective adhesive layers and bonding a polishing pad top layer to the subpad via the upper adhesive layer. The polishing pad optionally includes a window. Because the subpad is double-laminated, an opening can be formed through both the top and bottom adhesive layers as well as the subpad. Thus, when bonded to a top polishing pad layer having a window, the result is a layered polishing pad with a through optical path that does not include an adhesive layer.