The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 31, 2006
Filed:
Jul. 31, 2003
Alan F. Benner, Poughkeepsie, NY (US);
Evan G. Colgan, Chestnut Ridge, NY (US);
How Tzu Lin, Vestal, NY (US);
John H. Magerlein, Yorktown Heights, NY (US);
Frank L. Pompeo, Redding, CT (US);
Subhash L. Shinde, Cortlandt Manor, NY (US);
Daniel J. Stigliani, Jr., Hopewell Junction, NY (US);
Alan F. Benner, Poughkeepsie, NY (US);
Evan G. Colgan, Chestnut Ridge, NY (US);
How Tzu Lin, Vestal, NY (US);
John H. Magerlein, Yorktown Heights, NY (US);
Frank L. Pompeo, Redding, CT (US);
Subhash L. Shinde, Cortlandt Manor, NY (US);
Daniel J. Stigliani, Jr., Hopewell Junction, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An optoelectronic assembly for a computer system includes an electronic chip(s), a substrate, an electrical signaling medium, an optoelectronic transducer, and an optical coupling guide. The electronic chip(s) is in communication with the substrate, which is in communication with a first end of the electrical signaling medium. A second end of the electrical signaling medium is in communication with the optoelectronic transducer, and includes the optical coupling guide for aligning an optical signaling medium with the optoelectronic transducer. An electrical signal from the electronic chip is communicated to the optoelectronic transducer via the substrate and the electrical signaling medium. The optical transducer and electronic chip(s) share a common heat spreader, and communication to other groups of electronic chip(s) is done without the need for communication via a second level electrical package.