The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 24, 2006
Filed:
Feb. 09, 2004
Yao Tung Yen, Cupertino, CA (US);
Yao Tung Yen, Cupertino, CA (US);
Pericom Semiconductor Corp., San Jose, CA (US);
Abstract
Electronic devices packaged with arrayed solder balls, leads, or pads, such as Ball Grid Array (BGA) devices, are stacked together. Each stack has a bottom adapter card with metal contacts on a top surface in an array to match the array of solder balls of a lower BGA package, and final bonding pads on a bottom surface that are soldered to an underlying motherboard or printed-circuit board (PCB). An upper BGA package has its solder balls connected to a matching array of metal contacts on a top surface of an intermediate adapter card. Metal traces on the intermediate adapter card connect to lead frame pins that wrap around the edge of the intermediate adapter card and make contact with peripheral pads on the top surface of the bottom adapter card. Lead frame pins and peripheral pads can connect several intermediate adapter cards together with one bottom adapter card.