The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 24, 2006
Filed:
Nov. 30, 2004
Donald F. Weston, Phoenix, AZ (US);
William J. Dauksher, Mesa, AZ (US);
Ngoc V. Le, Gilbert, AZ (US);
Donald F. Weston, Phoenix, AZ (US);
William J. Dauksher, Mesa, AZ (US);
Ngoc V. Le, Gilbert, AZ (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A process is provided for fabricating a viabetween bonded wafers without undercutting an organic bonding material. The process for forming the viain a structure including a dielectric materialand an organic bonding material, comprises forming a resist materialon the dielectric layerand etching through the dielectric layerand the organic bonding materialwith 60CF/20Ar/60CHF/20N. The resist may then be removed with an anisotropic high density oxygen plasma.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile