The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 24, 2006

Filed:

Jun. 24, 2004
Applicants:

Cha Deok Dong, Kyungki-Do, KR;

Ii Keoun Han, Kyungki-Do, KR;

Inventors:

Cha Deok Dong, Kyungki-Do, KR;

II Keoun Han, Kyungki-Do, KR;

Assignee:

Hynix Semiconductor Inc., Ichon-Shi, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/762 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention relates to a method for forming an isolation film in a semiconductor device. After a trench for isolation is formed, a polymer film is stripped by a post cleaning process using BFN. A pre-treatment cleaning process using only SC-1 is performed and a sidewall oxidization process is then carried out. It is therefore possible to improve fail of the roughness of the trench sidewall and to easily strip polymer. Furthermore, since a conventional PET process is omitted, an isolation film manufacturing process is simplified. It is also possible to prohibit out-diffusion of dopants injected into a semiconductor substrate through a pre-treatment cleaning process using CLN N before the sidewall oxidization process. Incidentally, by forming a slope at the top corner of the trench, it is possible to prevent a gate oxide film thinning phenomenon that the gate oxide film thinner than a desired thickness is deposited at the trench corner. It is also possible to improve electrical properties of a device since an active region as much as a target critical dimension is secured.


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