The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2006
Filed:
Jun. 14, 2004
Shih-chang Lee, Kaohsiung, TW;
Cheng-yin Lee, Tainan, TW;
Yung-li LU, Linyuan Township, Kaohsiung County, TW;
Ying-tsai Yeh, Renwu Township, Kaohsiung County, TW;
Pei-chi Lin, Zihguan Township, Kaohsiung County, TW;
Shih-Chang Lee, Kaohsiung, TW;
Cheng-Yin Lee, Tainan, TW;
Yung-Li Lu, Linyuan Township, Kaohsiung County, TW;
Ying-Tsai Yeh, Renwu Township, Kaohsiung County, TW;
Pei-Chi Lin, Zihguan Township, Kaohsiung County, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
A contact sensor package has a substrate, a film, a sealant and a plurality of contact sensors disposed on the substrate. The contact sensors are disposed within the enclosed space defined by the substrate, the film and the sealant. The contact sensor package further has at least a ground conductive trace formed on the substrate and an electrostatic charge dissipation layer formed on a surface of the film and electrically connected to the ground conductive trace. The electrostatic charge dissipation layer has an upper surface that serves as a contact surface for a detecting a contact work-piece.