The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2006
Filed:
Oct. 19, 2004
Applicants:
Hideyo Osanai, Shiojiri, JP;
Takayuki Takahashi, Shiojiri, JP;
Makoto Namioka, Shiojiri, JP;
Inventors:
Assignee:
Dowa Mining Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/00 (2006.01); H01L 23/10 (2006.01); H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
Abstract
There is provided a metal/ceramic bonding substrate having improved reliability to heat cycles, and a method for producing the same. In a metal/ceramic bonding substratewherein a circuit forming metal plateis bonded to one side of a ceramic substrateand a radiating metal base plateis bonded to the other side thereof, at least part of the ceramic substrateis embedded in the metal base plate. The ceramic substrateis arranged substantially in parallel to the metal base member