The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 10, 2006
Filed:
Feb. 07, 2006
Hiroya Shimizu, Ryugasaki, JP;
Asao Nishimura, Kokubunji, JP;
Tosiho Miyamoto, Kodaira, JP;
Hideki Tanaka, Sagamihara, JP;
Hideo Miura, Koshigaya, JP;
Hiroya Shimizu, Ryugasaki, JP;
Asao Nishimura, Kokubunji, JP;
Tosiho Miyamoto, Kodaira, JP;
Hideki Tanaka, Sagamihara, JP;
Hideo Miura, Koshigaya, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A semiconductor device is provided which includes a semiconductor element having power pads for supplying a power potential, ground pads for supplying a ground potential, and signal pads for inputting and outputting a signal, all of which are formed on one main surface thereof. Power bumps for outside connection are connected with the power pad by power wiring sections, ground bumps for outside connection are connected with the ground pad by ground wiring sections, and signal bumps for outside connection are connected with the signal pad by signal wiring sections. The power wiring sections or the ground wiring sections are respectively located adjacently on both sides of the signal wiring sections and the power wiring sections are respectively located adjacently on sides of the ground wiring sections.