The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 10, 2006

Filed:

Feb. 19, 2003
Applicants:

Minh V. Ngo, Fremont, CA (US);

Ning Cheng, Cupertino, CA (US);

Jeff P. Erhardt, San Jose, CA (US);

Clarence B. Ferguson, San Jose, CA (US);

Cyrus Tabery, Sunnyvale, CA (US);

John Caffall, San Carlos, CA (US);

Tyagamohan Gottipati, Sunnyvale, CA (US);

Dawn Hopper, San Jose, CA (US);

Inventors:

Minh V. Ngo, Fremont, CA (US);

Ning Cheng, Cupertino, CA (US);

Jeff P. Erhardt, San Jose, CA (US);

Clarence B. Ferguson, San Jose, CA (US);

Cyrus Tabery, Sunnyvale, CA (US);

John Caffall, San Carlos, CA (US);

Tyagamohan Gottipati, Sunnyvale, CA (US);

Dawn Hopper, San Jose, CA (US);

Assignee:

Spansion, LLC, Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/336 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of protecting a charge trapping dielectric flash memory cell from UV-induced charging, including fabricating a charge trapping dielectric flash memory cell including a charge trapping dielectric charge storage layer in a semiconductor device; and during processing steps subsequent to formation of the charge trapping dielectric charge storage layer, protecting the charge trapping dielectric flash memory cell from exposure to a level of UV radiation sufficient to deposit a non-erasable charge in the charge trapping dielectric flash memory cell. In one embodiment, the step of protecting is carried out by selecting processes in BEOL fabrication which do not include use, generation or exposure of the semiconductor device to a level of UV radiation sufficient to deposit the non-erasable charge.


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