The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 2006

Filed:

Aug. 16, 2004
Applicants:

Anwar Ali, San Jose, CA (US);

Stan Mihelcic, Pleasanton, CA (US);

James G. Monthie, Fulton, MD (US);

Inventors:

Anwar Ali, San Jose, CA (US);

Stan Mihelcic, Pleasanton, CA (US);

James G. Monthie, Fulton, MD (US);

Assignee:

LSI Logic Corporation, Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01); H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01); H01L 23/488 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention is directed to methods for optimizing package and silicon co-design of an integrated circuit. A composite bump pattern for an integrated circuit is created based on a first library including at least one bump pattern template. PCB and Die constraints of the integrated circuit are then reviewed. A partial package design for the integrated circuit is generated based on a second library including at least one partial package template. A partial silicon design for said integrated circuit is started. A full package design for the integrated circuit is then completed. A full silicon design for the integrated circuit is completed.


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