The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 2006

Filed:

May. 24, 2004
Applicants:

Yogesh B. Gianchandani, Ann Arbor, MI (US);

Larry L. Chu, Madison, WI (US);

Kenichi Takahata, Ann Arbor, MI (US);

Ponnambalam Selvaganapathy, Freemont, CA (US);

Juda L. Shohet, Madison, WI (US);

Inventors:

Yogesh B. Gianchandani, Ann Arbor, MI (US);

Larry L. Chu, Madison, WI (US);

Kenichi Takahata, Ann Arbor, MI (US);

Ponnambalam Selvaganapathy, Freemont, CA (US);

Juda L. Shohet, Madison, WI (US);

Assignees:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 27/26 (2006.01); G01R 31/02 (2006.01); G01R 31/302 (2006.01);
U.S. Cl.
CPC ...
Abstract

A micromachined probe apparatus and methods for making and using same to characterize liquid in a fluidic channel and map embedded charge in a sample on a substrate are provided. The probe apparatus includes an integrated scanning tip and a dither actuation mechanism. The actuation is achieved using a bent-beam electrothermal actuator, and the probe tip is insulated from the actuator with a wide isolation gap. The device is fabricated by a modified micro electro-discharge machining process which allows electrical isolation within the micromachined structure using an epoxy plug. The apparatus may be used to measure changes in the external surface potential of a microfluidic channel as a function of varying pH of liquid inside the channel. The apparatus also may be used to map embedded charge in a thin layer on a substrate, showing it to be suitable for monitoring microelectronics manufacturing processes.


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