The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 2006

Filed:

Nov. 25, 2003
Applicants:

Shiping Guo, North Brunswick, NJ (US);

David Gotthold, Hillsborough, NJ (US);

Milan Pophristic, North Brunswick, NJ (US);

Boris Peres, Jersey City, NJ (US);

Ivan Eliashevich, Maplewood, NJ (US);

Bryan S. Shelton, Bound Brook, NJ (US);

Alex D. Ceruzzi, Princeton Junction, NJ (US);

Michael Murphy, Somerset, NJ (US);

Richard A. Stall, Belle Mead, NJ (US);

Inventors:

Shiping Guo, North Brunswick, NJ (US);

David Gotthold, Hillsborough, NJ (US);

Milan Pophristic, North Brunswick, NJ (US);

Boris Peres, Jersey City, NJ (US);

Ivan Eliashevich, Maplewood, NJ (US);

Bryan S. Shelton, Bound Brook, NJ (US);

Alex D. Ceruzzi, Princeton Junction, NJ (US);

Michael Murphy, Somerset, NJ (US);

Richard A. Stall, Belle Mead, NJ (US);

Assignee:

Emcore Corporation, Somerset, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

A nitride semiconductor is grown on a silicon substrate by depositing a few mono-layers of aluminum to protect the silicon substrate from ammonia used during the growth process, and then forming a nucleation layer from aluminum nitride and a buffer structure including multiple superlattices of AlGaN semiconductors having different compositions and an intermediate layer of GaN or other Ga-rich nitride semiconductor. The resulting structure has superior crystal quality. The silicon substrate used in epitaxial growth is removed before completion of the device so as to provide superior electrical properties in devices such as high-electron mobility transistors.


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