The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 03, 2006
Filed:
Aug. 20, 2001
Edward O. Shaffer, Ii, Midland, MI (US);
Kevin E. Howard, Midland, MI (US);
Joost J. M. Waeterloos, Vlaams Brabant, BE;
Jack E. Hetzner, Saginaw, MI (US);
Paul H. Townsend, Iii, Midland, MI (US);
Lynne K. Mills, Midland, MI (US);
Sheila Gombar-fetner, Midland, MI (US);
Larry R. Wilson, Beaverton, MI (US);
Edward O. Shaffer, II, Midland, MI (US);
Kevin E. Howard, Midland, MI (US);
Joost J. M. Waeterloos, Vlaams Brabant, BE;
Jack E. Hetzner, Saginaw, MI (US);
Paul H. Townsend, III, Midland, MI (US);
Lynne K. Mills, Midland, MI (US);
Sheila Gombar-Fetner, Midland, MI (US);
Larry R. Wilson, Beaverton, MI (US);
Dow Global Technologies Inc., Midland, MI (US);
Abstract
This invention is a method comprising providing a substrate, forming a first layer on the substrate, wherein the first layer has a dielectric constant of less than 3.0 and comprises an organic polymer, applying an organosilicate resin over the first layer, removing a portion of the organosilicate resin to expose a portion of the first layer, and removing the exposed portions of the first layer. The invention is also an integrated circuit article comprising an active substrate containing transistors and an electrical interconnect structure containing a pattern of metal lines separated, at least partially, by layers or regions of an organic polymeric material having a dielectric constant of less than 3.0 and further comprising a layer of an organosilicate resin above at least one layer of the organic polymer material.