The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 03, 2006
Filed:
Mar. 31, 2006
Thomas Laursen, New Haven, CT (US);
Justin Quarantello, Higley, AZ (US);
Thomas Stotts, Chandler, AZ (US);
Paul Franzen, Gilbert, AZ (US);
Thomas Laursen, New Haven, CT (US);
Justin Quarantello, Higley, AZ (US);
Thomas Stotts, Chandler, AZ (US);
Paul Franzen, Gilbert, AZ (US);
Novellus Systems, Inc., San Jose, CA (US);
Abstract
Methods are provided for controlling adjustable pressure zones of a CMP carrier. A method comprises determining a first thickness of a layer on a wafer underlying a first zone of the carrier. A first portion of the layer underlying the first zone is removed. The first zone is configured to exert a first pressure against the second surface of the wafer. A second thickness of the layer underlying the first zone is determined and a target thickness corresponding to a predetermined thickness profile is selected. A second pressure for the first zone is calculated using the first thickness, the second thickness, the first pressure, and the target thickness. The pressure exerted by the first zone against the second surface of the wafer is adjusted to the second pressure and the steps are repeated for a second zone.