The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 26, 2006
Filed:
May. 11, 2004
Yasushi Tokumo, Tokyo, JP;
Shigeki Maekawa, Tokyo, JP;
Yoshihiro Kashiba, Tokyo, JP;
Shigeru Takada, Tokyo, JP;
Yasushi Tokumo, Tokyo, JP;
Shigeki Maekawa, Tokyo, JP;
Yoshihiro Kashiba, Tokyo, JP;
Shigeru Takada, Tokyo, JP;
Misubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
Two resilient sections are connected to a tip end which is to be brought into contact with an external connection terminal of a contact belonging to a test socket of an electronic device or semiconductor package. The resilient sections provided opposite to each other and are bent so as to extend horizontally with respect to the tip end. The force exerted downward on the tip end is equally distributed between the plurality of resilient sections. The resilient sections are eventually deflected downwardly without involvement of horizontal sliding action. The force which is exerted on the tip end in reaction to the downward deflection of the curved portions brings the tip end into pressing contact with the external connection terminal without involvement of horizontal sliding action of the tip end with respect to the external connection terminal.