The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 26, 2006
Filed:
Sep. 22, 2004
Takayuki Kaida, Gifu, JP;
Ryu Shimizu, Mizuho, JP;
Mitsuru Okigawa, Nagoya, JP;
Tetsuya Miwa, Gifu, JP;
Takashi Noma, Ohta, JP;
Takayuki Kaida, Gifu, JP;
Ryu Shimizu, Mizuho, JP;
Mitsuru Okigawa, Nagoya, JP;
Tetsuya Miwa, Gifu, JP;
Takashi Noma, Ohta, JP;
Sanyo Electric Co., Ltd., Osaka, JP;
Abstract
A semiconductor device allowing simplification of a fabrication process is provided. This semiconductor device comprises a first insulator film, consisting of a single material, formed to be in contact with the upper surface of a semiconductor chip including a circuit, a first wire formed to be in contact with the upper surface of the first insulator film and a second wire formed to extend along the side surface and the lower surface of the semiconductor chip and connected to the lower surface of the first wire exposed by partially removing the first insulator film.