The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 26, 2006
Filed:
Jan. 26, 2005
Hei Ming Shiu, Hong Kong, HK;
Wai Wong Chow, Hong Kong, HK;
Qing-chun He, Tianjin, CN;
Freescale Semiconductor, INC, Austin, TX (US);
Abstract
A semiconductor device () includes a first leadframe () having a perimeter () that defines a cavity () and leads () extending inwardly from the perimeter, and a second leadframe () having top and bottom surfaces and a die paddle surrounding a die receiving area (). An integrated circuit () is placed within the die receiving area of the second leadframe. The IC has bonding pads () located on a peripheral portion of its top surface. The second leadframe and the IC are in facing relation with the first leadframe such that the leads of the first leadframe are electrically connected to respective ones of the bonding pads. A mold compound () is injected between the first and second leadframes and covers the second leadframe top surface and a central area of the first surface of the IC. At least the bottom surfaces of the leads are exposed.