The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 26, 2006

Filed:

Apr. 20, 2004
Applicants:

Lawrence A. Clevenger, LaGrangeville, NY (US);

Louis L. Hsu, Fishkill, NY (US);

Carl J. Radens, LaGrangeville, NY (US);

Li-kong Wang, Montvale, NJ (US);

Kwong Hon Wong, Wappingers Falls, NY (US);

Inventors:

Lawrence A. Clevenger, LaGrangeville, NY (US);

Louis L. Hsu, Fishkill, NY (US);

Carl J. Radens, LaGrangeville, NY (US);

Li-Kong Wang, Montvale, NJ (US);

Kwong Hon Wong, Wappingers Falls, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method and structure for an integrated circuit chip has a logic core which includes a plurality of insulating and conducting levels, an exterior conductor level and passive devices having a conductive polymer directly connected to the exterior conductor level. The passive devices contain RF devices which also includes resistor, capacitor, and/or inductor. The resistors can be serpentine resistors and the capacitors can be interdigitated capacitors.


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