The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 26, 2006
Filed:
Dec. 05, 2002
Kishore K. Chakravorty, San Jose, CA (US);
Kishore K. Chakravorty, San Jose, CA (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Methods are provided for fabricating plated through hole conductive core substrate which eliminate the secondary step of producing a through hole in the dielectric material plugging the core through hole. In one embodiment of the method in accordance with the invention, a two-step lamination process is provided. One side of the conductive core is provided with a dielectric laminate, a portion of which flows into and coats the core through hole wall. Excess dielectric material flows out of the core through hole preventing plugging. Similarly, the other side of the conductive core is provided with a dielectric laminate, a portion of which flows into the core through hole completing the coating of the core through hole wall forming a dielectric liner. The dielectric liner insulates the conductive core through hole wall from a conductive layer deposited onto the dielectric liner forming a plated through hole.