The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 19, 2006
Filed:
Nov. 06, 2001
Lawrence N. Crane, Brookfield, CT (US);
Mark M. Konarski, Old Saybrook, CT (US);
Erin K. Yaeger, Coventry, CT (US);
Afranio Torres-filho, Enfield, CT (US);
J. Paul Krug, Middletown, CT (US);
Rebecca Tishkoff, Hamden, CT (US);
Lawrence N. Crane, Brookfield, CT (US);
Mark M. Konarski, Old Saybrook, CT (US);
Erin K. Yaeger, Coventry, CT (US);
Afranio Torres-Filho, Enfield, CT (US);
J. Paul Krug, Middletown, CT (US);
Rebecca Tishkoff, Hamden, CT (US);
Henkel Corporation, Rocky Hill, CT (US);
Abstract
A flip-chip type integrated circuit chip including a chip die having electrical contacts arranged in a predetermined pattern and capable of providing electrical interconnection with a carrier substrate is provided. The chip die includes a fluxing agent disposed on a surface of the electrical contacts, and a curable thermosetting underfill composition distinct from the fluxing agent and disposed in a flowable form over the chip die. Upon mating of the chip die with the substrate and heating, the electrical contacts flow and the thermosetting underfill composition cures, thus adhering the chip die to the substrate, forming a circuit assembly.