The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 12, 2006

Filed:

Mar. 25, 2005
Applicants:

Shawn L. Lloyd, Tigard, OR (US);

John G. Oldendorf, Portland, OR (US);

J. Shelton Lewis, Hillsboro, OR (US);

Michael Kochanowski, Portland, OR (US);

Inventors:

Shawn L. Lloyd, Tigard, OR (US);

John G. Oldendorf, Portland, OR (US);

J. Shelton Lewis, Hillsboro, OR (US);

Michael Kochanowski, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/00 (2006.01); H01R 13/40 (2006.01);
U.S. Cl.
CPC ...
Abstract

An integrated circuit (IC) package socket is provided with an array of single-piece socket contact pins arranged to connect an IC package to a circuit board. The single-piece contact pin is supported at a middle portion of the contact pin and includes two acutely angled bends that allow the two ends of the contact pin to independently resiliently engage the package lands of the IC package and the contact pads of the circuit board. The contact pins are further shaped and arranged to laterally swipe the package lands and contact pads during engagement to scrape away or penetrate through any oxide or other contaminant buildup.


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