The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2006
Filed:
Jan. 24, 2005
Min-lin Lee, Hsinchu, TW;
Chin-sun Shyu, Hsinchu, TW;
Shur-fen Liu, Hsinchu, TW;
Jing-pin Pan, Hsinchu, TW;
Jinn-shing King, Hsinchu, TW;
Min-Lin Lee, Hsinchu, TW;
Chin-Sun Shyu, Hsinchu, TW;
Shur-Fen Liu, Hsinchu, TW;
Jing-Pin Pan, Hsinchu, TW;
Jinn-Shing King, Hsinchu, TW;
Industrial Technology Research Institute, Hsinchu, TW;
Abstract
An interleaving striped capacitor substrate structure for pressing-type print circuit boards is disclosed. To meet the high-frequency, high-speed, and high-density requirements in modern electronic systems, the interleaving striped capacitor substrate structure uses several dielectric materials of different dielectric coefficients to make a dielectric layer. One dielectric layer can be stacked on another to form a multi-layered capacitor substrate so that a single capacitor substrate can provide the highest capacitance required for the decoupling capacitor to suppress high-frequency noise signals, and the lower dielectric coefficient substrate required for high-speed signal transmission. This simultaneously achieves the effects of reducing high-frequency transmission time and suppressing high-frequency noise.