The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2006
Filed:
Jan. 12, 2004
Applicants:
Yoshiharu Hidaka, Osaka, JP;
Katsuyuki Ikenouchi, Toyama, JP;
Inventors:
Yoshiharu Hidaka, Osaka, JP;
Katsuyuki Ikenouchi, Toyama, JP;
Assignee:
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
Abstract
In a semiconductor substrate having a notch in an edge portion thereof, each of the two shoulder portions of the notch is configured as an arc and the difference in curvature between the two shoulder portions of the notch is not less than 0 mm and not more than 0.1 mm.
Hidaka, Yoshiharu. (2006). Semiconductor substrate, method for fabricating the same, and method for fabricating semiconductor device (U.S. Patent No. 7102206). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7102206
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile