The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2006
Filed:
Jun. 23, 2005
Boguslaw A. Swedek, San Jose, CA (US);
Bret W. Adams, Sunnyvale, CA (US);
Sanjay Rajaram, Sunnyvale, CA (US);
David A. Chan, Sunnyvale, CA (US);
Manoocher Birang, Los Gatos, CA (US);
Boguslaw A. Swedek, San Jose, CA (US);
Bret W. Adams, Sunnyvale, CA (US);
Sanjay Rajaram, Sunnyvale, CA (US);
David A. Chan, Sunnyvale, CA (US);
Manoocher Birang, Los Gatos, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
A computer program product for process control in chemical mechanical polishing is described. The product includes instructions to cause a processor to receive a measurement of an initial pre-polishing thickness of a layer of a substrate from a metrology station, determine a value for a parameter of an endpoint algorithm from the initial thickness of the substrate, receive a monitoring signal generated from monitoring in-situ polishing of the substrate, process the monitoring signal to detect a signal feature indicating a final or intermediate endpoint and send instructions to stop polishing when an endpoint criterion is detected using the endpoint algorithm with the determined value for the parameter.