The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2006
Filed:
Jan. 07, 2004
Frank Sauk, San Ramon, CA (US);
Frank Sauk, San Ramon, CA (US);
Credence Systems Corporation, Milpitas, CA (US);
Abstract
A package optimized for thinning of an attached semiconductor die. The package comprises an extension ring attached to a bottom surface of the package, and a die carrier plate attached to the extension ring for receiving a semiconductor die. The die carrier plate may be attached to the extension ring by an adhesive that permits removal of the carrier plate from the semiconductor die and extension ring by a small applied force after encapsulation of the semiconductor die. The encapsulant may include a filler material for modifying properties such as hardness, thermal coefficient of expansion, thermal conductivity. The materials used for the extension ring and encapsulant may be selected for compatibility with the die lapping operation.