The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2006

Filed:

Jun. 09, 2004
Applicants:

Walter Schwarzenbach, Saint Nazaire les Eymes, FR;

Jean-marc Waechter, Saint Vincent de Mercuze, FR;

Inventors:

Walter Schwarzenbach, Saint Nazaire les Eymes, FR;

Jean-Marc Waechter, Saint Vincent de Mercuze, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/31 (2006.01); H01L 21/469 (2006.01); H01L 21/30 (2006.01); H01L 21/46 (2006.01); H01L 21/332 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for heat treatment of a semiconductor wafer placed on a support. The method includes subjecting the wafer to a heat treatment with a slow temperature rise from an initial temperature to a treatment ending temperature, and minimizing slip lines that would otherwise result in the wafer from the heat treatment by introducing at least one temperature plateau of constant temperature and of predetermined duration in the heat treatment before reaching the treatment ending temperature. The method reduces the temperature gradients on the wafer to minimize slip lines in the wafer resulting from the heat treatment.


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