The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2006
Filed:
Feb. 10, 2005
Applicants:
Nobuharu Noji, Tokyo, JP;
Hiroshi Sobukawa, Tokyo, JP;
Masami Nagayama, Tokyo, JP;
Koji Ono, Tokyo, JP;
Mutsumi Saito, Tokyo, JP;
Inventors:
Nobuharu Noji, Tokyo, JP;
Hiroshi Sobukawa, Tokyo, JP;
Masami Nagayama, Tokyo, JP;
Koji Ono, Tokyo, JP;
Mutsumi Saito, Tokyo, JP;
Assignee:
Ebara Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A processing method is performed for processing a workpiece such as a semiconductor wafer. The processing method utilizes an apparatus comprising a cover for covering a portion of a surface, to be processed, of a workpiece, a process chamber formed by the cover and the surface, to be processed, of the workpiece, and a sealing portion provided between the cover and the surface of the workpiece for sealing the process chamber.