The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7097886 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 29, 2006

Filed:

Dec. 13, 2002
Applicants:

Farhad K. Moghadam, Saratoga, CA (US);

Michael S. Cox, Davenport, CA (US);

Padmanabhan Krishnaraj, San Francisco, CA (US);

Thanh N. Pham, San Jose, CA (US);

Zhenjiang Cui, Santa Clara, CA (US);

Inventors:

Farhad K. Moghadam, Saratoga, CA (US);

Michael S. Cox, Davenport, CA (US);

Padmanabhan Krishnaraj, San Francisco, CA (US);

Thanh N. Pham, San Jose, CA (US);

Zhenjiang Cui, Santa Clara, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05H 1/24 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of depositing an insulating film over a substrate having a gap formed between two adjacent raised features. The method includes depositing one portion of the insulating film over the substrate and in the gap using a high density plasma process that has simultaneous deposition and sputtering components and depositing another portion of the insulating film over the substrate and in the gap using an atomic layer deposition process. In some embodiments the portion of the film deposited by an atomic layer deposition process is deposited over the portion of the film deposited using a high density plasma CVD technique. In other embodiments, the portion of the film deposited by a high density plasma CVD process is deposited over the portion of the film deposited using an atomic layer deposition process.


Find Patent Forward Citations

Moghadam, Farhad. (2006). Deposition process for high aspect ratio trenches (U.S. Patent No. 7097886). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7097886

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