The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 22, 2006
Filed:
Oct. 28, 2004
Applicants:
Masahiko Hasunuma, Yokohama, JP;
Akitsugu Hatazaki, Yokkaichi, JP;
Inventors:
Masahiko Hasunuma, Yokohama, JP;
Akitsugu Hatazaki, Yokkaichi, JP;
Assignee:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/28 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor device comprises a semiconductor chip in which a multilayer interconnection structure having an interlayer insulation film with a low relative dielectric constant is formed on a silicon substrate and a sealing resin layer which coats the semiconductor chip. The sealing resin layer meets, in coefficient of linear expansion (α) at room temperature, Young's modulus (E) at room temperature and thickness (h) thereof, a relationship of the following formula (1)<0.891/{(α−α)  (1)