The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 22, 2006

Filed:

Jan. 10, 2002
Applicant:

Christophe Prior, Le Versoud, FR;

Inventor:

Christophe Prior, Le Versoud, FR;

Assignee:

STMicroelectronics SA, Montrouge, FR;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/28 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor package includes a mounting and electrical connection plate, and a semiconductor component having front and rear surfaces and including a sensor. The rear surface of the semiconductor component is attached to the mounting and electrical connection plate and the front surface is attached to the sensor. An insert is adjacent the front face of the semiconductor component and the sensor and has an access passage for exposing the sensor. A plug is in the access passage of the insert. A body of encapsulation material surrounds the mounting and electrical connection plate, the semiconductor component and the insert.


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Prior, Christophe. (2006). Sensor semiconductor package, provided with an insert, and method for making same (U.S. Patent No. 7095123). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7095123

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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