The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 22, 2006
Filed:
Oct. 16, 2001
Masato Fujinaga, Tokyo, JP;
Masato Fujinaga, Tokyo, JP;
Renesas Technology Corp., Tokyo, JP;
Abstract
The object of the present invention is to implement an enhancement in a noise eliminating characteristic of a wiring compatibly with promotion of microfabrication and simplification of a manufacturing process. Upper and side surfaces of a wiring () for transmitting a signal are continuously covered by a conductor layer () with insulators (), () and () interposed therebetween in a section crossing a direction of extension thereof, and the conductor layer () is connected to a semiconductor substrate (). Moreover, a periphery of a wiring () for transmitting a signal is continuously covered by the conductor layer () and a conductor layer () with insulators (), (), () and () interposed therebeween in a section crossing a direction of extension thereof. The wiring () is electrically connected to the semiconductor substrate () through a conductive plug () filled in a contact hole () formed in the conductor layer ().