The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 15, 2006

Filed:

Dec. 11, 2003
Applicants:

Sung Soon Park, Seoul, KR;

Jin Seong Kim, Kyounggi-do, KR;

Young Ho Kim, Seoul, KR;

Inventors:

Sung Soon Park, Seoul, KR;

Jin Seong Kim, Kyounggi-do, KR;

Young Ho Kim, Seoul, KR;

Assignee:

Amkor Technology, Inc., Chandler, AZ (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0232 (2006.01); H01L 31/0203 (2006.01);
U.S. Cl.
CPC ...
Abstract

Disclosed is an image sensor package and a method for manufacturing the same. The image sensor package comprises an image sensor die, a substrate, a support wall having screw threads on the outer peripheral surface thereof and a mount into which a barrel including a plurality of lenses and an infrared blocking glass is mounted. The screw threads formed on the outer peripheral surface of the support wall are engaged with those formed on the inner peripheral surface of the mount. At least one passive element is provided on the substrate at the outer peripheral side of the support wall, thereby increasing the packaging density of the image sensor package.


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