The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 15, 2006

Filed:

Dec. 02, 2003
Applicants:

Shigeki Nojima, Yokohama, JP;

Shoji Mimotogi, Yokohama, JP;

Satoshi Tanaka, Kawasaki, JP;

Toshiya Kotani, Machida, JP;

Shigeru Hasebe, Yokohama, JP;

Koji Hashimoto, Yokohama, JP;

Soichi Inoue, Yokohama, JP;

Osamu Ikenaga, Yokohama, JP;

Inventors:

Shigeki Nojima, Yokohama, JP;

Shoji Mimotogi, Yokohama, JP;

Satoshi Tanaka, Kawasaki, JP;

Toshiya Kotani, Machida, JP;

Shigeru Hasebe, Yokohama, JP;

Koji Hashimoto, Yokohama, JP;

Soichi Inoue, Yokohama, JP;

Osamu Ikenaga, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01F 9/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Disclosed is a method of manufacturing a photo mask comprising preparing mask data for a mask pattern to be formed on a mask substrate, calculating edge moving sensitivity with respect to each of patterns included in the mask pattern using the mask data, the edge moving sensitivity corresponding to a difference between a proper exposure dose and an exposure dose to be set when a pattern edge varies, determining a monitor portion of the mask pattern, based on the calculated edge moving sensitivity, actually forming the mask pattern on the mask substrate, acquiring a dimension of a pattern included in that portion of the mask pattern formed on the mask substrate which corresponds to the monitor portion, determining evaluation value for the mask pattern formed on the mask substrate, based on the acquired dimension, and determining whether the evaluation value satisfies predetermined conditions.


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