The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 15, 2006
Filed:
Feb. 17, 2003
Masuhiro Natsuhara, Itami, JP;
Hirohiko Nakata, Itami, JP;
Akira Kuibira, Itami, JP;
Sumitomo Electric Industries, Ltd., Osaka, JP;
Abstract
Joint formations that, in joining together joining members employed in a variety of electrical and electronic components, yield sufficiently high joint strength in the direction perpendicular to the plane in which two joining members join, and meanwhile in the direction parallel to the joint plane. First and second joining members have respective joint phases each formed with a different number of distinct yet continuous conformational faces, defining the joint phases so that neither is the matching complement of the other. A bonding agent interposed between the joint phases joins the joining members together. The difference in thermal expansion coefficient between the two joining members, and between them and the bonding agent, is 5.0×10/° C. or less. The joining members are a metal such as tungsten or Cu—W, or a ceramic such as AlN or SiN; and glass or a solder material is utilized for the bonding agent.