The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2006
Filed:
May. 28, 2004
Jeanne P. Bickford, Essex Junction, VT (US);
Vernon R. Norman, Cary, NC (US);
Michael R. Ouellette, Westford, NC (US);
Mark S. Styduhar, Hinesburg, VT (US);
Brian Worth, Jericho, VT (US);
Jeanne P. Bickford, Essex Junction, VT (US);
Vernon R. Norman, Cary, NC (US);
Michael R. Ouellette, Westford, NC (US);
Mark S. Styduhar, Hinesburg, VT (US);
Brian Worth, Jericho, VT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method for providing quality control on wafers running on a manufacturing line is disclosed. The resistances on a group of manufacturing test structures within a wafer running on a wafer manufacturing line are initially measured. Then, an actual distribution value is obtained based on the result of the measured resistances on the group of manufacturing test structures. The difference between the actual distribution value and a predetermined distribution value is recorded. Next, the resistances on a group of design test structures within the wafer are measured. The measured resistances of the group of design test structures are correlated to the measured resistances of the group of manufacturing test structures in order to obtain an offset value. The resistance of an adjustable resistor circuit within the wafer and subsequent wafers running on the wafer manufacturing line are adjusted according to the offset value.