The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2006
Filed:
Sep. 16, 2004
Karl Heinz Priewasser, Kirchheim, DE;
Sylvia Winter, Laussintz, DE;
Karl Heinz Priewasser, Kirchheim, DE;
Sylvia Winter, Laussintz, DE;
Disco Hi-Tec Europe GmbH, Kirchheim, DE;
Infineon Technologies AG, Munich, DE;
Abstract
Disclosed is a method for generating chip stacks during the production of chips from wafers, the chips located on the wafer being separated from one another, the wafer being ground thin and the chips being stacked to form chip stacks, the chips being checked for the purpose of a functional check, characterized in that the chips are checked in a first work step, that adhesive material is applied on the good chips, whereas the bad chips are not provided with adhesive material, that the wafer is assembled and ground thin afterwards and that the bad chips are subsequently removed and replaced by good chips.