The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2006
Filed:
Jan. 08, 2004
Yoshihisa Yamashita, Kyoto, JP;
Koichi Hirano, Hirakata, JP;
Seiichi Nakatani, Hirakata, JP;
Masaki Suzumura, Hisai, JP;
Yoshihisa Yamashita, Kyoto, JP;
Koichi Hirano, Hirakata, JP;
Seiichi Nakatani, Hirakata, JP;
Masaki Suzumura, Hisai, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A thermally conductive substrate includes a thermally conductive resin sheet member attached to a lead frame. The lead frame comprises a thermally conductive resin sheet member and it is integrated with the thermally conductive resin sheet member on the lead frame. The thermally conductive resin sheet member is formed from a thermosetting resin mixture which comprises 70 to 90 parts by weight of an inorganic filler and 5 to 30 parts by weight of a thermosetting resin composition including a thermosetting resin, and the thermosetting resin is in a semi-cured state.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile