The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2006
Filed:
Feb. 02, 2001
Takahiro Osawa, Kodaira, JP;
Yoichi Kawata, Higashiyamato, JP;
Atsushi Fujishima, Kodaira, JP;
Tamaki Wada, Higashimurayama, JP;
Kenichi Imura, Higashiyamato, JP;
Takahiro Osawa, Kodaira, JP;
Yoichi Kawata, Higashiyamato, JP;
Atsushi Fujishima, Kodaira, JP;
Tamaki Wada, Higashimurayama, JP;
Kenichi Imura, Higashiyamato, JP;
Renesas Technology Corporation, Tokyo, JP;
Hitachi ULSI Systems Co., Ltd., Tokyo, JP;
Abstract
A memory card wherein a substrate is affixed to a cap is formed without the projection of substrate edges from a back surface of the cap. The memory card includes a substrate having a sealing member bonded to a recess in the cap. By utilizing a difference in thermal expansion coefficient between the sealing member and the substrate, the substrate is warped so that its central portion projects away from the cap. The shallow recess is deeper than the sum of the thickness of the substrate and the thickness of an adhesive for bonding the substrate to the bottom of the shallow recess, whereby peripheral edges of the substrate retract into the shallow recess without projecting from the back surface of the cap. The cap is shaped as a card several millimeters thick. A memory chip and control chip are incorporated in the sealing member.