The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 18, 2006
Filed:
Dec. 22, 2003
Chemical mechanical planarization (cmp) system and method for preparing a wafer in a cleaning module
Applicant:
Xiuhua Zhang, Cupertino, CA (US);
Inventor:
Xiuhua Zhang, Cupertino, CA (US);
Assignee:
Lam Research Corporation, Fremont, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 7/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method for preparing a wafer in a cleaning module is described. In this method, slurry is dispensed onto a surface of a wafer. Next, a chemical mechanical planarization (CMP) operation is conducted in the cleaning module by contacting a surface of a brush with the surface of the wafer. Subsequently, a cleaning operation is conducted in the cleaning module. A CMP pad and a CMP system also are described.