The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 18, 2006
Filed:
Jul. 08, 2003
Hidetaka Yamasaki, Hyogo, JP;
Itaru Matsuo, Tokyo, JP;
Hidekazu Manabe, Tokyo, JP;
Kenji Imamura, Tokyo, JP;
Kenichirou Katou, Hyogo, JP;
Mitsutaka Matsuo, Hyogo, JP;
Hidetaka Yamasaki, Hyogo, JP;
Itaru Matsuo, Tokyo, JP;
Hidekazu Manabe, Tokyo, JP;
Kenji Imamura, Tokyo, JP;
Kenichirou Katou, Hyogo, JP;
Mitsutaka Matsuo, Hyogo, JP;
Renesas Technology Corp., Tokyo, JP;
Renesas Device Design Corporation, Itami, JP;
Abstract
In a lead forming apparatus for a semiconductor device, a holder holds a semiconductor device with leads to be formed, the semiconductor device having leads extending from a package. Two die assemblies (for bending, for cutting, or the like) are set in parallel, each including top and bottom dies matched with each other. A mover changes relative distance between the two die assemblies. The top and bottom dies in the two die assemblies are positioned so the leads of the semiconductor device held on the holder are between the dies.