The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 2006
Filed:
Jul. 30, 2002
Peter E. Kirkpatrick, Berkeley, CA (US);
Jean-marc Verdiell, Palo Alto, CA (US);
Craig Schulz, Fremont, CA (US);
Marc Epitaux, Sunnyvale, CA (US);
Rickie C. Lake, Sunnyvale, CA (US);
Peter E. Kirkpatrick, Berkeley, CA (US);
Jean-Marc Verdiell, Palo Alto, CA (US);
Craig Schulz, Fremont, CA (US);
Marc Epitaux, Sunnyvale, CA (US);
Rickie C. Lake, Sunnyvale, CA (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Described herein is a hermetic fiber optic package that may have a wide bandwidth radio frequency (e.g., between 9 kHz and 300 GHz) interface and a multilayer substrate provides a platform to integrated various components such as, for example, integrated circuits having electronic components, optoelectronic components, or optics. In one embodiment, the substrate has a wide bandwidth surface mountable interface that may be a single ended or a differential that allows for an electrical signal to pass from the exterior of the package to the interior. The interior of the package contains a 'riser' that is used to bring an electrical signal from the plane of the substrate to the plane close to the optical axis. This riser includes a transmission line to achieve the change in height. The transmission line can be single ended or differential. Also within the package is a 'submount' upon which electrical/optical/electro-optic components can be integrated.