The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7075180 B1

PDF
Full Text
Expired
Date of Patent:
Jul. 11, 2006

Filed:

Dec. 29, 2003
Applicants:

Siva G. Narendra, Portland, OR (US);

James W. Tschanz, Portland, OR (US);

Victor Zia, Beaverton, OR (US);

Badarinath Kommandur, Hillsboro, OR (US);

Vivek K. DE, Beaverton, OR (US);

Inventors:

Siva G. Narendra, Portland, OR (US);

James W. Tschanz, Portland, OR (US);

Victor Zia, Beaverton, OR (US);

Badarinath Kommandur, Hillsboro, OR (US);

Vivek K. De, Beaverton, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/10 (2006.01); H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
Abstract

In some embodiments, a method includes providing an integrated circuit (IC) die in a package. The IC die may have a metal layer on a back surface of the IC die. The method may also include applying a bias signal to the IC die via the metal layer.


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Narendra, Siva. (2006). Method and apparatus for applying body bias to integrated circuit die (U.S. Patent No. 7075180). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7075180

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