The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 11, 2006

Filed:

Sep. 11, 2003
Applicants:

Hidaki Takizawa, Kawasaki, JP;

Shougo Hayashi, Kawasaki, JP;

Takeshi Kinjo, Kawasaki, JP;

Makoto Tachibanaki, Kawasaki, JP;

Kenji Okamoto, Kawasaki, JP;

Inventors:

Hidaki Takizawa, Kawasaki, JP;

Shougo Hayashi, Kawasaki, JP;

Takeshi Kinjo, Kawasaki, JP;

Makoto Tachibanaki, Kawasaki, JP;

Kenji Okamoto, Kawasaki, JP;

Assignee:

Fujitsu Limited, Kawasaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/04 (2006.01); H01L 31/036 (2006.01); H01L 31/0376 (2006.01); H01L 31/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

A thin film transistor matrix device including an insulating substrate, a plurality of thin film transistors arranged on the insulating substrate, and a plurality of picture element electrodes arranged on the insulating substrate in a matrix and connected to the thin film transistors. The device also includes a plurality of bus lines made of a first conducting film, a first insulating film formed on the first conducting film, a second conducting film formed on the first insulating film, and a second insulating film formed on the first insulating film and the second conducting film. Additionally, first and second contact holes are formed outside an image display region in which the plurality of picture elements are formed. The first conducting film is connected to the third conducing film via the first contact hole, and the second conducting film is connected to the third conducting film via the second contact hole.


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