The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 2006
Filed:
Jun. 07, 2002
Shinichi Ogimoto, Kanagawa, JP;
Koji Morita, Kanagawa, JP;
Shinichi Ogimoto, Kanagawa, JP;
Koji Morita, Kanagawa, JP;
Shibaura Mechatronics Corporation, Yokohama, JP;
Abstract
An electronic part compression bonding apparatus includes a compression bonding unit which bonds the electronic parts onto the substrate by thermocompression, a pressure supply unit, a pressure control unit which controls pressure, a heating unit which heats the compression bonding unit, a temperature control unit, and a thermocompression bonding control unit which controls the pressure control unit and the heating unit based on thermocompression bonding condition data in which at least one of pressure and heating temperature is variably set during a process from start until completion of a thermocompression bonding operation of the electronic parts. In the thermocompression bonding condition data, the pressure is set to a first pressure in a first stage in a process of the thermocompression bonding operation and a second pressure, which is lower than the first pressure, in a second stage that follows the first stage.