The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 11, 2006

Filed:

Mar. 02, 2006
Applicants:

Hengju Cheng, Mountain View, CA (US);

Lee L. Xu, Cupertino, CA (US);

Brian Kim, Fremont, CA (US);

Darren Crews, Cupertino, CA (US);

Jesse Chin, Hillsborough, CA (US);

Inventors:

Hengju Cheng, Mountain View, CA (US);

Lee L. Xu, Cupertino, CA (US);

Brian Kim, Fremont, CA (US);

Darren Crews, Cupertino, CA (US);

Jesse Chin, Hillsborough, CA (US);

Assignee:

Stratos International, Inc., Chicago, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/36 (2006.01);
U.S. Cl.
CPC ...
Abstract

A transceiver assembly includes a frame section, a rigid circuit board, a flex circuit, and a controller chip. The frame section includes an optoelectronic device containing a set of photoactive components, a signal processing chip for providing drive signals to the set of photoactive components, and a flex circuit layer. The rigid circuit board includes a first rigid printed circuit board layer, a second rigid printed circuit board layer, and a flex circuit layer. The flex circuit also forms the flex circuit layers in the rigid circuit board and the frame section. The flex circuit is adapted for electrically coupling the first and second printed circuit board layers in the rigid circuit board to the frame section. The controller chip is mounted on a surface of the first rigid printed circuit board layer.


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