The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 04, 2006

Filed:

Dec. 21, 2004
Applicants:

Christian L. Belady, McKinney, TX (US);

Gary W. Williams, Rowlett, TX (US);

Shaun L Harris, McKinney, TX (US);

Steven A. Belson, Plano, TX (US);

Eric C. Peterson, McKinney, TX (US);

Stuart C. Haden, Lucas, TX (US);

Inventors:

Christian L. Belady, McKinney, TX (US);

Gary W. Williams, Rowlett, TX (US);

Shaun L Harris, McKinney, TX (US);

Steven A. Belson, Plano, TX (US);

Eric C. Peterson, McKinney, TX (US);

Stuart C. Haden, Lucas, TX (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

Embodiments include apparatus, methods, and systems of an electronic module for a system board having at least one pass-thru hole. An exemplary electronic module, connectable to a system board with a pass-thru hole, includes a first portion coupled to one side of the system board. The first portion has a printed circuit board (PCB) with plural processors. A second portion of the electronic module couples to a second, opposite side of the system board. The second portion has a power system board electrically coupled to the first portion. The second portion also includes a thermal dissipation device that extends through the pass-thru hole of the system board.


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