The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 2006
Filed:
Aug. 03, 2004
Applicant:
Takashi Kumamoto, Tsukuba, JP;
Inventor:
Takashi Kumamoto, Tsukuba, JP;
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
Multi-purpose planarizing/back-grind/pre-under-fill arrangements for bumped wafers and dies, in which a planarizing coating provides improved and continued surface protection to the circuit surface of a wafer or die throughout back-grinding and subsequent mounting operations, and provides improved stiffening/strengthening of the wafer and die throughout back-grinding and subsequent mounting operations.