The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 2006
Filed:
Nov. 24, 2004
Shaun L. Harris, Mckinney, TX (US);
Steven A. Belson, Plano, TX (US);
Eric C. Peterson, McKinney, TX (US);
Gary W. Williams, Rowlett, TX (US);
Christian L. Belady, Mckinney, TX (US);
Shaun L. Harris, Mckinney, TX (US);
Steven A. Belson, Plano, TX (US);
Eric C. Peterson, McKinney, TX (US);
Gary W. Williams, Rowlett, TX (US);
Christian L. Belady, Mckinney, TX (US);
Hewlett-Packard Development Company, L.P., Houston, TX (US);
Abstract
Embodiments include apparatus, methods, and systems having a multi-chip module with stacked redundant power. An exemplary apparatus has a module having plural processors. A first power system is coupled, in a vertically stacked configuration, to the module for providing power to the module. A second power system provides power to the module and is coupled, in a vertically stacked configuration, to the first power system. Each power system serves as a duplicate for preventing failure of the module upon failure of one of the power systems. A thermal dissipation device is disposed between both the first and second power systems and the first power system and module such that the thermal dissipation device dissipates heat, via heat exchange, away from the processors, the first power system, and the second power system.