The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7067918 B1

PDF
Full Text
Expired
Date of Patent:
Jun. 27, 2006

Filed:

Mar. 18, 2004
Applicants:

Haruhiko Murata, Aichi, JP;

Kazuhisa Sato, Kounan, JP;

Tomonori Matsuura, Komaki, JP;

Inventors:

Haruhiko Murata, Aichi, JP;

Kazuhisa Sato, Kounan, JP;

Tomonori Matsuura, Komaki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

A wiring board comprising: a wiring laminate portion including dielectric layers containing polymeric material and conductor layers laminated alternately so as to form a first main surface out of one of said dielectric layers; and a plurality of metal terminal pads disposed on said first main surface; wherein: each of said metal terminal pads has a structure in which a Cu-plated layer is disposed on a side of said first main surface and an Au-plated layer is disposed in an outermost surface layer portion of said metal terminal pad, while an electroless Ni-plated layer having a P content not higher than 3% by weight is disposed as a barrier metal layer between said Cu-plated layer and said Au-plated layer.


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Murata, Haruhiko. (2006). Wiring board (U.S. Patent No. 7067918). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7067918

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