Haruhiko Murata

Title: Haruhiko Murata: Innovator in Circuit Board Technology

Introduction

Haruhiko Murata is a prominent inventor based in Aichi, Japan. He has made significant contributions to the field of circuit board technology, holding a total of 5 patents. His innovative designs and methods have advanced the capabilities of wiring boards and circuit boards, making them more efficient and reliable.

Latest Patents

Murata's latest patents include a unique wiring board that features a wiring laminate portion with dielectric layers containing polymeric material and conductor layers laminated alternately. This design forms a first main surface out of one of the dielectric layers. Additionally, the wiring board includes a plurality of metal terminal pads, each designed with a Cu-plated layer and an Au-plated layer, separated by an electroless Ni-plated barrier metal layer. Another notable patent is for a circuit board that incorporates flattened and leveled solder bumps, ensuring a coplanarity of 0.5 µm or less per 1 mm. These solder bumps are formed through methods such as cold pressing, hot pressing, or grinding.

Career Highlights

Haruhiko Murata is currently employed at NGK Spark Plug Company, Limited, where he continues to innovate and develop new technologies in circuit board design. His work has been instrumental in enhancing the performance and reliability of electronic components.

Collaborations

Throughout his career, Murata has collaborated with notable colleagues, including Kazuhisa Sato and Kazuo Kimura. These partnerships have fostered a creative environment that encourages the exchange of ideas and advancements in technology.

Conclusion

Haruhiko Murata's contributions to circuit board technology exemplify his dedication to innovation and excellence. His patents reflect a deep understanding of the complexities involved in electronic design, and his work continues to influence the industry positively.